Väitös (fysiikka): MSc Masoud Ebrahimzadeh

Aika

26.1.2024 klo 12.00 - 16.00
MSc Masoud Ebrahimzadeh esittää väitöskirjansa ”Studies of oxide-semiconductor and metal-semiconductor interfaces for reducing defect densities” julkisesti tarkastettavaksi Turun yliopistossa perjantaina 26.01.2024 klo 12.00 (Turun yliopisto, Quantum, XVII -luentosali, Turku).

Yleisön on mahdollista osallistua väitökseen myös etäyhteyden kautta: https://utu.zoom.us/j/67486189118

Vastaväittäjänä toimii tohtori Rainer Timm (Lundin yliopisto, Ruotsi) ja kustoksena professori Kalevi Kokko (Turun yliopisto). Tilaisuus on englanninkielinen. Väitöksen alana on fysiikka.

Väitöskirja yliopiston julkaisuarkistossa: https://urn.fi/URN:ISBN:978-951-29-9579-0

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Tiivistelmä väitöstutkimuksesta:

Semiconductor chips form a basis of the information and communication technologies of which electricity consumption increases continuously. Also, the consumption of raw materials, chemicals, and energy increases in the manufacturing processes of semiconductor chips. Therefore, the target to manufacture energy-efficient and durable chips with sustainable methods becomes more and more relevant to society.

The semiconductor chip is typically as good as its weakest part. Surface areas of a semiconductor crystal are nowadays the weakest part in many chips because semiconductor surfaces include a high density of material defects. These defects degrade the electrical and optical performance as well as the durability of a chip. The surface problems largely arise from a strong reactivity of the surfaces with the environment during fabrication processes. The presented PhD work attempts to find solutions to the surface challenges.

In my PhD research, I focused on semiconductor surfaces, which are beneath a metal or oxide film. Such buried semiconductor interfaces guide the electric current transport in chips. The key findings are:

* Reducing densities of the harmful surface defects by means of low-temperature methods which decrease the heating energy consumption.

* Decreasing semiconductor surface resistance which decreases energy losses in chips

* Finding an optimized method to clean a semiconductor surface.
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